HP and AMD Scholarships Details Successful recipients will each receive a scholarship package worth RM25,000. The scholarships shall be disbursed on a lump sump basis and shall be paid directly to the recipients. This is a non-bonded scholarship. This scholarship program is opened to all students who fulfill the eligibility criteria. Part-time students can apply too. This scholarship program is opened to both undergraduate & postgraduate students.
This is a companion discussion topic for the original entry at http://scholarships.malaysia-students.com/2008/09/hp-and-amd-scholarships-worth-rm75000.html?m=0